Martview RB03-QT5 CPU BGA Reballing Stencil for Qualcomm Snapdragon 460 / 662 (SM4250 / SM6115)

Martview RB03-QT5 CPU BGA Reballing Stencil for Qualcomm Snapdragon 460 SM4250 / 662 SM6115

Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template

Features:

• **Accurate Alignment and High Precision**: Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
• **Flexible and Durable**: Rigid and flexible stencil, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
• **Burr-Free and Consistent Mesh**: High precision, no burrs, so that every mesh can be of the same size and not stuck
• **High-Temperature Resistance**: Selected steel has strong toughness and is not easy to deform at high temperature
• **Optimal Tin Planting Experience**: Accurate alignment, good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
• **Precise Alignment and Solder Joints**: Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
• **Square Hole Fillet Design**: Square hole fillet design, high precision, burr-free, so that every mesh can the same size does not jam tin
• **Specifications**:
  • Size: 65.4mm x 65.4mm
  • Stencil net thickness: 0.12mm
  • Square holes and rounded corners