Martview RB03-QT19 Qualcomm Snapdragon 8Gen1 SM8450 CPU BGA Reballing Stencil
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Product details
Description
Martview RB03-QT19 CPU BGA Reballing Stencil for Qualcomm Snapdragon 8Gen1 SM8450
Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template
Features:
Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
Rigid and flexible stencil, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
High precision, no burrs, so that every mesh can be of the same size and not stuck
Selected steel has strong toughness and is not easy to deform at high temperature
Accurate alignment, good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
Square hole fillet design, high precision, burr-free, so that every mesh can the same size does not jam tin
Summary:** High-quality alloy steel stencil with accurate alignment and high precision
Size: 65.4mm x 65.4mm
Stencil net thickness: 0.12mm
Square holes and rounded corners
Package includes:
1 x Stencil
