Martview RB03-QT8 CPU BGA Reballing Stencil: Qualcomm Snapdragon 636 / 660 (SDM636 / SDM660)

Martview RB03-QT8 CPU BGA Reballing Stencil for Qualcomm Snapdragon 636 SDM636 / 660 SDM660

Click Here to order Martview RB-03 Multi-functions Automatic Positioning Universal BGA Reballing Station Holder Template

Features:

• Imported alloy steel, high material, and technology, dirt-resistant, easy to clean
• Rigid and flexible stencil, maintaining the flexibility of the steel, normal deformation and bending can be easily restored to its original shape
• High precision, no burrs, so that every mesh can be of the same size and not stuck
• Selected steel has strong toughness and is not easy to deform at high temperature
• Accurate alignment, good flexibility, durability, and high-temperature resistance, give you a different tin planting experience
• Accurate alignment, each mesh is checked according to the original drawing to ensure that there should be no fewer solder joints, which are completely consistent and accurately aligned
• Square hole fillet design, high precision, burr-free, so that every mesh can the same size does not jam tin
• **Summary:** High-quality stencil with accurate alignment, good flexibility, and high-temperature resistance for efficient tin planting.
• Size: 65.4mm x 65.4mm
• Stencil net thickness: 0.12mm
• Square holes and rounded corners

Package includes:

• 1 x Stencil