iPhone 12 Full Series Mechanic 3D Double-sided Middle Layer Motherboard Reballing Stencil

Mechanic 3D Middle Layer Motherboard Double-sided Reballing Stencil for iPhone 12 Full Series

Product Description:

This Mechanic 3D Middle Layer Motherboard Double-sided Reballing Stencil is designed for iPhone 12 Full Series. It features an embedded 3D half-engraved step process with a composite material thickness of 0.3mm, a groove half-engraved thickness of 0.15mm, and a ball thickness of 0.15mm.

Key Features:

• Embedded 3D half-engraved step process: Composite material thickness of 0.3mm, groove half-engraved thickness of 0.15mm, and ball thickness of 0.15mm
• Removable from the net and tin planting: Effectively prevents steel mesh from bulging
• Square hole tin planting mesh: Precise mesh alignment, close fit, no offset, accuracy up to ±0.003mm
• Round and full solder joints: Tin is removed from the net, solder balls are bright and full, and evenly formed
• Good toughness and hardness: High-temperature resistance of 585 ℃, no bulging, high flatness, not easy to deform
• Double-sided positioning structure design: Positioning tin planting and glue removal on the upper and lower layers of the motherboard

**Summary:** This stencil features a 3D half-engraved step process, removable tin planting mesh, precise square hole tin planting, round and full solder joints, good toughness and hardness, and a double-sided positioning structure design.

Package Includes:

• 1 x Stencil