Mechanic 559 223 10CC 100G PCB BGA Soldering Paste Flux for Phone Repair Solder Ball Flux
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223-10CC
223-100G
559-10CC
559-100GProduct details
Description
Mechanic 559 223 10CC 100G PCB BGA Soldering Paste Flux Solder Ball Flux for Phone Repair
Product Description:
This BGA Solder Paste is a high-viscosity no-clean flux designed for PCB, SMD, reworking, and can be used for soldering and reballing of computer and phone chips.
Key Features:
- High-quality alloyed powder and resinic pasty flux mixture to avoid pale yellow residue and ensure easy cleaning of the board.
- Multi-purpose application for soldering paste for cell phone PCB and SMD, electronics welding, soldering, etc.
- Protects electronic components by helping to repair circuit boards and prevent damage.
- A necessary material for mobile phone mainboard repair.
- Summary:** High-viscosity no-clean flux for PCB, SMD, reworking, and computer/phone chip soldering and reballing.
Package Includes:
- 1 x Soldering Paste Flux
Important Note:
Due to FedEx DHL restrictions on shipping liquids, this product will be sent via Singapore Post - Standard Mail or Registered Mail. If your order includes other products, we will separate this item and send it via Singapore Post, while the other products will be sent via the courier of your choice. Thank you for your understanding.
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