Mechanic Heat Kit: Intelligent Reflow Soldering Heating Platform for iPhone X to 15 Pro Max Motherboard Repair

Mechanic Heat Kit Intelligent Reflow Soldering Heating Platform for iPhone X to 15Pro Max Motherboard

Features:

• Reflow soldering heating platform with 5 professional mode selections and 3 common mode operations
• Especially designed for original solder of mobile phone motherboard, featuring curve heating, intelligent and safe desoldering, and reflow
• New MCH ceramic double heating element for faster heating, more uniform temperature, and stable performance
• 5 application scene modes: degumming, layering, lamination, tin planting, and welding, switchable at will
• 3 commonly used memory temperatures, automatic recording of current temperature (saves when power is off) and manual recording of current temperature mode
• Turbofan blades for heat dissipation, built-in strong wind cooling system, with fan speed adapting to temperature for efficient heat dissipation
• Monitor temperature changes and realize reflow soldering temperature curve data monitoring
• Real-time detection of motherboard heating and cooling temperature, no need to switch interface to view
• Scope of application: iPhone X/XS/XS Max/11/11 Pro/11Pro Max/12 Mini/12/12 Pro/12Pro Max/13 Mini/13/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max/15/15 Plus/15 Pro/15Pro Max
• Summary: Advanced reflow soldering heating platform with 5 professional modes, MCH ceramic double heating element, and real-time temperature monitoring.

Key Description:

• "Add button" click to adjust temperature, long press to start heating
• "Minus key" click to adjust temperature, long press to start cooling
• "MEM key" click to switch three temperature memory, long press to set memory temperature
• "SET button" click to switch five modes, long press to set mode temperature

Package includes:

• 1 x Host
• 1 x Power Cord
• 6 x Modules
• 17 x Steel mesh