Mechanic iT3 Pro Intelligent Temperature Control Preheating Platform - iPhone X-13 Series Motherboard ChipRepair

Mechanic iT3 Pro Intelligent Temperature Control Preheating Platform for iPhone X-13 Series Motherboard Chip

Options:

• Package 1: iT3 Pro host + X-12 Pro Max mold with stencil(4pcs) + universal mold + dot matrix CPU mold
• Package 2: iT3 Pro host + X-13 Pro Max mold with stencil(6pcs) + universal mold + dot matrix CPU mold
• Package 3: iT3 Pro host + 13 series mold with stencil(2pcs)
• Package 4: iPhone 13 series mold with stencil only(2pcs)
• Package 5: iT3 Pro host + 7-13 Pro Max rear camera mold
• Package 6: iPhone 7-13 Pro Max rear camera mold only(2pcs)

Features:

• Used for iPhone motherboard layered and fitting, tin planting, BGA desoldering, IC glue removal, dot matrix Face ID repair, rear camera repair
• **Intelligent Adjustable Temperature**: Modular design for easy expansion of new modules
• No air gun and no soldering iron, just plug and use
• Multiple combination modules, good scalability, easy to expand new modules
• Host size: 12*14cm
• Voltage 110V/220V
• **All-in-One Solution**: Layering, tin planting, bonding, desoldering, and glue removal integrated
• **Customizable Temperature**: Intelligent adjustable temperature for different melting points
• No air gun, no soldering iron, fast and accurate layered tin planting in 3 minutes to fit the motherboard
• Modular design, multiple combination modules, good scalability, easy to expand new modules
• **Plug and Play Technology**: Hot-swap supported for efficient work
• Suitable for iPhone X/XS/XS Max/11/11Pro/11 Pro Max/12/12 Pro/12 Pro Max/12 Mini/13/13 Mini/13 Pro/13 Pro Max