Mechanic MagTin X CPU Degumming & Tinning Platform - For iPhone, Huawei, Qualcomm Devices

Mechanic MagTin X CPU Degumming & Tinning Platform for iPhone / Huawei / Qualcomm

Introducing the ultimate CPU degumming and tinning solution for iPhone, Huawei, and Qualcomm devices.

Key Features:

**Summary:** Efficient CPU degumming and tinning solution for various devices.

• CPU Degumming Made Easy: Quickly removes CPU chip black glue with our Mechanic CPU degumming liquid brush, ensuring a safe and point-free process.
• Strong Magnetic Levitation Design: Our built-in magnets provide a strong adsorption force, allowing for automatic clamping and accurate alignment of the slider under the magnetic field.
• Accurate Tinning with Steel Stencil Design: Ensures each solder joint is precisely placed, resulting in firm and reliable connections with no false soldering.
• Universal Compatibility: Supports various BGA chips for iPhone, Huawei, and Qualcomm series devices, with corresponding chip stencils for different repairs.
• Durable and Heat-Resistant: Made from synthetic stone with nano-composite materials, this platform withstands temperatures up to 500℃, resisting static interference, corrosion, and wear.

What's Included:

• 1 x Platform (without Stencils)

Note: Stencils are not included and need to be purchased separately.