IX5 Ultra Universal Mechanical Preheating Platform for Pre-Planting Tin and Degumming Motherboard Repair

Mechanical IX5 Ultra Universal Preheating Platform for Motherboard Planting Tin / Degumming

Product Overview

This Mechanical IX5 Ultra universal preheating platform is a breakthrough innovation for motherboard planting tin/degumming, offering uniform heating without the need for an air gun or soldering iron.

Key Features:

• Uniform Heating**: No air gun, no soldering iron, ensuring consistent heat distribution.
• Compact & Lightweight**: Aluminum alloy panel, freely controlled temperature, and compact design make it easy to handle and store.
• Versatile Applications**: Supports layering, tinning, laminating, degumming, and dot matrix repair for all sizes of cell phone motherboards.
• Freely Controlled Temperature**: Preheating temperature range of 20~260°C for precise control.

Summary:

This preheating platform is ideal for motherboard delamination, lamination, and dot matrix repair, offering uniform heating, compact design, and freely controlled temperature.

Specifications:

• Name: Universal Preheating Platform
• Gross Weight: 381.7g
• Model: Breakthrough iX 5Ultra
• Net Weight: 181.7g
• Voltage: 110V /220V
• Product Size: 80*80*57.6mm
• Package Size: 182*150*55mm
• Scope: Support motherboard delamination, lamination, and dot matrix repair
• Preheating Temperature Range: 20~260°C

Package Includes:

• 1 x Preheating Platform
• 1 x Power Cable