Mega-idea iPhone 14 Series Multi-functional Middle Frame Positioning BGA Reballing Platform

Mega-idea Multi-functional Middle Frame Positioning BGA Reballing Platform for iPhone 14 Series

Features:

• Universal Compatibility: Strong magnetic universal base, various models for more expansions of reballing.
• iPhone 14 Series Support: Mega-idea Multi-functional Reballing Platform supports iPhone 14/14 Plus/14 Pro/14Pro Max.
• Future-Proof: Applicable to Mega-idea Multi-functional Middle Frame Reballing Platform Use with the base will update more models.
• Strong Magnetic Base: Strong magnetic universal base with three strong magnetic magnet.
• Lifetime Experience: Universal base for all models, a lifetime experience in one purchase.
• Updatable Models: Replace and add up updated models for more expansions.
• No Limits: Models keep updating, add up without limits, free from base replacements.
• Precision Engineering: CNC high precision one-piece machining, stable positioning of the motherboard, no slanting when reballing.
• Anti-Slip Design: Anti-slip foot pad of the base, two anti-slip silicone foot pads, avoid slippery during reballing.
• Secure Clamping: Detailed process in each step of reballing, secure clamping of the motherboards in high temperatures.
• Efficient Reballing: Avoid the large area of mesh detaching at the same time, resulting in solder paste being carried away.

Specification:

• Brand: Mega-idea
• Product: Mega-idea Multi-functional Middle Frame Reballing Platform
• Models: Multi-functional magnetic universal base
• Functions: Motherboard reballing and repair
• Material: Synthetic Stone, Steel
• Reballing Platform Packaging Size: 61*101*8.5mm
• Base Packaging Size: 67*107*13mm
• Reballing Platform Weight: 32g
• Base Weight: 118g

How to Use:

• Motherboard Installation precise positioning, place the motherboard on the corresponding positioning columns Match the model, and place them on the synthetic stone reballing platform.
• Place the reballing platform into the universal base and attach the reballing platform to the magnetic base.
• Place the corresponding model of the stencil on the corresponding reballing platform, and attach it to the magnetic base.
• Apply low-temperature solder paste evenly on the stencil mesh.
• After applying the paste, remove the stencil, do not use a hot air gun to blow directly on the stencil.
• After removing the stencil, use the hot air gun to heat it again, and blow until the paste has melted.

Package includes:

• 1 x Reballing Platform