MiJing 3D A14 BGA Reballing Stencil - Tin Steel Net for iPhone 12, 12 Pro, 12 Pro Max, 12 mini
0 out of 5 stars
No review yet| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.1% |
| 10 | NaN | -8.6% |
Product details
Description
MiJing 3D A14 BGA Reballing Stencil Plant Tin Steel Net for iPhone 12 / 12 Pro / 12 Pro Max / 12 mini
Product Features:
The stencil is compatible with iPhone 12 / 12 Pro / 12 Pro Max / 12 mini Touch IC, Baseband, font IC, audio IC, power IC, and A14 CPU.
3D Design for Easy Use: Enables rapid alignment with the tinning position of IC, making it easier to remove formed solder balls. Suitable for both beginners and experts.
High Success Rate: Plant tin with a high success rate, and solder balls can be formed in one attempt with proficiency.
Heat-Resistant: Can withstand high temperatures and be heated directly by a hot air gun.
Package Includes:
1 x 3D Stencil
Summary:** 3D Design for easy use, high success rate of planting tin, and heat-resistant. Perfect for repairing iPhone 12 series.
