Mijing iPhone 13 Series / A15 IC 3D BGA Stencil Tin Plant Net
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Product details
Description
Mijing 3D BGA Stencil Tin Plant Net for iPhone 13 Series/A15 IC
Features:
Stepped groove design enables stencil to align with tinning position of IC rapidly
The square holes design makes it easier to take out the formed solder balls
Easy to Use: This 3D stencil is easy to use no matter you are a new or an expert.
High Success Rate: With the high success rate of planting tin, the solder balls can be formed once after you are proficient
Durable: This 3D planting stencil is thicker than ordinary stencils in the market. Less tendency of deformation makes its using life be longer
Note: Some new products have blue protect film, Please remove it before you use it
Package Includes:
1 x 3D Stencil
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