Mijing iPH-15 0.12mm BGA Square Holes Reballing Stencil for iPhone 12 Series (12, 12 Mini, 12 Pro, 12 Pro Max) CPU
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Product details
Description
Mijing iPH-15 0.12mm BGA Square Holes Reballing Stencil for iPhone 12/12 Mini/12 Pro/12 Pro Max CPU
Features:
- High-quality BGA Reballing Stencil**: MiJing ultra-thin steel template, just 0.12mm thickness
- Precision Square Hole**: Manual planting Tin net, for iPhone 12/12 Mini/12 Pro/12 Pro Max
- Laser Engraving**: Grooves pinpoint for accurate alignment
- Easy to Use**: German Craftsmanship ensures a hassle-free experience
- Summary:** Ultra-thin, precision-made stencil for efficient iPhone CPU reballing
Notice:
- Please Planting tin net again the chip foot, the temperature of the hot air gun is controlled within 250 degrees
- Too high temperature is going to make the product deformed, secure with tweezers planting tin net
- Apply the solder paste evenly, make sure that each hole is covered with solder paste, clean the surface of the steel net with a clean cloth
- Then blow and weld the ball with a hot air gun, after cooling slightly the steel net tube is separated from the chip
Package includes:
- 1 x Steel Net
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