Mijing iPH-17 0.12mm 2D BGA Square Holes Reballing Stencils for iPhone 13 Series (13 / 13 Mini / 13 Pro / 13 Pro Max) CPU

Mijing iPH-17 0.12mm 2D BGA Square Holes Reballing Stencils for iPhone 13/13 Mini/13 Pro/13 Pro Max CPU

Features:

• **Accurate Alignment**: New patented stepped groove 2D BGA planting stencil for precise alignment.
• Stepped groove design enables stencil to align with tinning position of IC rapidly.
• The square holes design makes it easier to take out the formed solder balls.
• This 2D stencil is easy to use no matter whether you are a new or an expert.
• With the high success rate of planting tin, the solder balls can be formed once you are proficient.
• No Need for IC Holder Station.
• This 2D planting stencil is thicker than ordinary stencils in the market, making it less prone to deformation and increasing its lifespan.
• Less tendency of deformation makes its using life longer.

Specification:

• Material: Stainless steel
• Weight: 0.01kg
• Type: 2D reballing template
• Model Number: MJ 2D Reballing Stencil
• Design: Stepped groove
• Suit: for iPhone 13 series

Package includes:

• 1 x Steel Net