Mijing KC8 Quicky Knife Set: Remove Maintenance for Mobile Phone Motherboard Glue
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Product details
Description
Mijing KC8 Quicky Remove Maintenance Knife Set for Mobile Phone Motherboard Glue Removal
Product Overview
This multi-functional glue removal knife set is designed for mobile phone motherboard glue removal and other maintenance tasks. With its high-temperature resistance, corrosion resistance, and high hardness, it's the perfect tool for any repair job.
Key Features:
- Quick Blade Removal: Press the rebound structure to quickly remove the blade.
- Multi-Functional: Suitable for cutting black glue, side glue removal, motherboard glue removal, prying hard disk, and more.
- Durable Materials: Fine high-carbon elastic steel blade with high-temperature resistance, corrosion resistance, and high hardness.
- Pure Hand Polishing: Surface vacuum plating process for strong corrosion resistance and high-temperature durability.
- New Blade Design: Rigid and flexible design with strength and more toughness.
- Comfortable Grip: Universal ergonomic knife handle for comfortable use.
- Precise Laser Cutting: Each piece of blade material is laser cut to ensure a high degree of product uniformity.
- Summary: High-quality, multi-functional glue removal knife set for mobile phone motherboard maintenance.
What's in the Box:
- 1 x Handle
- 8 x Blades
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