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Mijing Z20 4-in-1 Middle Layer Motherboard BGA Reballing Platform for iPhone 14 Series (14 / 14 Plus / 14 Pro / 14 Pro Max)

mijing z20-4-in-1-middle-layer-motherboard-bga-reballing-platform-5

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Product details

Description

Mijing Z20 4-in-1 Middle Layer Motherboard BGA Reballing Platform for iPhone 14 / 14 Plus / 14 Pro / 14Pro Max


Features:

  • Mijing 4-in-1 BGA Reballing Stencil Platform for iPhone 14/ 14 Plus / 14 Pro/ 14Pro Max convenient and faster for reballing BGA without any damage, offer you the best solution for iPhone 14 series BGA reballing and repairing
    **Saves time and effort, minimizes damage risk**


How to Use:

  • Install the main board on the platform
  • Cover the BGA reballing stencil on the mainboard
  • Evenly spread tin on the cover of the reballing stencil
  • Remove the reballing stencil cover
  • Take out the motherboard and cooperate with the hot air gun to solidify the tin point


Package Includes:

  • 1 x Fixture
  • 2 x Steel mesh
mijing z20-4-in-1-middle-layer-motherboard-bga-reballing-platform-5
mijing z20-4-in-1-middle-layer-motherboard-bga-reballing-platform-1
mijing z20-4-in-1-middle-layer-motherboard-bga-reballing-platform-2
mijing z20-4-in-1-middle-layer-motherboard-bga-reballing-platform-3
mijing z20-4-in-1-middle-layer-motherboard-bga-reballing-platform-4

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