Mijing Z20 4-in-1 Middle Layer Motherboard BGA Reballing Platform for iPhone 14 Series (14 / 14 Plus / 14 Pro / 14 Pro Max)

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Seller: Worldswa Shenzhen
ID: MV-221008WSAVA4
Weight: 0.45 kg
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| 3 | NaN | -2.4% |
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Product details
Description
Mijing Z20 4-in-1 Middle Layer Motherboard BGA Reballing Platform for iPhone 14 / 14 Plus / 14 Pro / 14Pro Max
Features:
- Mijing 4-in-1 BGA Reballing Stencil Platform for iPhone 14/ 14 Plus / 14 Pro/ 14Pro Max convenient and faster for reballing BGA without any damage, offer you the best solution for iPhone 14 series BGA reballing and repairing
**Saves time and effort, minimizes damage risk**
How to Use:
- Install the main board on the platform
- Cover the BGA reballing stencil on the mainboard
- Evenly spread tin on the cover of the reballing stencil
- Remove the reballing stencil cover
- Take out the motherboard and cooperate with the hot air gun to solidify the tin point
Package Includes:
- 1 x Fixture
- 2 x Steel mesh





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