Mijing Z20 Pro 18-in-1 Motherboard Middle Layer: iPhone X to 14Pro Max Planting Tin Platform

0 out of 5 stars
No review yetQty | Price | Discount |
---|---|---|
1 | NaN | |
3 | NaN | -3.1% |
5 | NaN | -5.4% |
10 | NaN | -8.5% |
Product details
Description
Mijing Z20 Pro 18-in-1 Motherboard Middle Layer Planting Tin Platform for iPhone X to 14Pro Max
Features:
Mijing Z20 Pro 18-in-1 Motherboard Middle Layer BGA Reballing Stencil Platform Jig Fixture is a professional BGA Reballing Stencil Fixture for iPhone X/XR/Xs/Xs Max/11/11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max, convenient and faster for reballing BGA without any damage, offer you the best solution for BGA reballing and repairing.
**Summary:** Professional BGA Reballing Stencil Fixture for iPhone X to 14Pro Max.
How to Use:
Install the main board on the platform.
Cover the BGA reballing stencil on the mainboard.
Evenly spread tin on the cover of the reballing stencil.
Remove the reballing stencil cover.
Take out the motherboard and cooperate with the hot air gun to solidify the tin point.
Package Includes:
1 x 18-in-1 Planting Tin Platform.









