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Mijing Z20 Pro 18-in-1 Motherboard Middle Layer: iPhone X to 14Pro Max Planting Tin Platform

mijing z20-pro-18-in-1-motherboard-middle-layer-planting-tin-platform-1

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Product details

Description

Mijing Z20 Pro 18-in-1 Motherboard Middle Layer Planting Tin Platform for iPhone X to 14Pro Max


Features:

  • Mijing Z20 Pro 18-in-1 Motherboard Middle Layer BGA Reballing Stencil Platform Jig Fixture is a professional BGA Reballing Stencil Fixture for iPhone X/XR/Xs/Xs Max/11/11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max, convenient and faster for reballing BGA without any damage, offer you the best solution for BGA reballing and repairing.

    **Summary:** Professional BGA Reballing Stencil Fixture for iPhone X to 14Pro Max.


How to Use:

  • Install the main board on the platform.

  • Cover the BGA reballing stencil on the mainboard.

  • Evenly spread tin on the cover of the reballing stencil.

  • Remove the reballing stencil cover.

  • Take out the motherboard and cooperate with the hot air gun to solidify the tin point.


Package Includes:

  • 1 x 18-in-1 Planting Tin Platform.

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