Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A8-A17, Hisilicon, Qualcomm Snapdragon Processors
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Description
Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A8-A17/Hisilicon/Qualcomm Snapdragon
Product Overview
This comprehensive CPU chip BGA stencil platform set is designed for iPhone A8-A17, Hisilicon, and Qualcomm Snapdragon. It provides a precise and efficient solution for chip installation and removal.
Key Features
- Automatic Precise Positioning: Ensures accurate chip alignment and placement.
- New Magnetic Dynamic Original Positioning: A innovative technology for secure and reliable chip placement.
- Strong Magnetic Force Automatic Clamping: Holds the chip firmly in place during installation and removal.
Installation Method
- Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh).
- Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip).
What's in the Box
- 1 x Tin Planting Platform Set
Summary
This product provides a convenient and efficient solution for iPhone A8-A17, Hisilicon, and Qualcomm Snapdragon chip installation and removal, with automatic precise positioning, magnetic dynamic original positioning, and strong magnetic force automatic clamping.
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