iPhone X Multi-Function Motherboard Cooling Soldering Desoldering Platform with BGA Reballing Positioning Fixture
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Product details
Description
Professional iPhone Motherboard Repair Solution: Multi-Function BGA Reballing Positioning Fixture
This comprehensive platform is designed for iPhone X motherboard repair, offering a range of features to assist professionals in CPU NAND chip positioning, disassembly, soldering, and more.
Key Features:
Heat Conduction and IC Protection: Pure copper heat conduction block prevents tin-burst on the back IC of the motherboard, while a heat conduction sticker ensures metal doesn't touch the IC directly.
Automatic CPU Positioning: No manual positioning needed, improving the success rate of repairs.
Stability and Non-Slip: Non-slip foot pad ensures the platform remains stable during use.
Precision Tin Planting: Integrated layer tin planting function with precision stencils produced by world-leading laser technology.
Motherboard Layer Separation: Added structure for motherboard layer separation and positioning installation.
Precision Positioning: Designed with precision positioning column for efficient repairs in separating, soldering, and installation.
Durable and Long-Lasting: Pure copper heat conduction material treated with a special process to maintain its new surface color.
High-Temperature Resistance: Imported synthetic stone materials tested and improved for precision processing, withstanding 500-degree direct heating without deformation.
Package Includes:
1 x Working Platform
1 x NAND BGA Reballing Net
