MiJing 3D A11 BGA Reballing Stencil: Tin Steel Net for iPhone 8, 8 Plus, X
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Product details
Description
Original MJ 3D A11 BGA Reballing Stencil Plant Tin Steel Net for iPhone 8 / iPhone 8 Plus / iPhone X Touch IC, Baseband, Font IC, Audio IC, Power IC, A11 CPU
Key Features:
3D Design for Easy Alignment: Enables stencil to align with tinning position of IC rapidly, making it easier to take out the formed solder balls. Easy to use for both new and expert users.
High Success Rate of Planting Tin: The solder balls can be formed once after you are proficient, ensuring a high success rate.
High-Temperature Resistant: Can be heated directly by the hot air gun, ensuring durability and long-lasting performance.
What's in the Box:
1 x 3D Stencil
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