Qianli 4-in-1 Magnetic Middle Frame BGA Reballing Platform for iPhone 14 Series (14 / 14 Plus / 14Pro / 14Pro Max)

Qianli 4-in-1 Magnetic Middle Frame BGA Reballing Platform for iPhone 14/14 Plus/14Pro/14Pro Max

Features:

• **4-in-1 Middle frame reballing platform**: Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge, for iPhone 14/14 Plus/14Pro/14Pro Max
• Compact and easy to use: To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
• Magnet sliding dislocation design: Smart application of the sliding dislocation design, easy to take
• **CNC high-precision integrated processing**: Stable positioning for the motherboard, no deviation in reballing
• Strong magnetic attraction: Accurate positioning no offset, and encountering high-temperature magnetism will not weaken
• High-temperature magnetic strong pressing: Prevents the stencils from bulging caused by high temperature
• Avoiding SIM card base not being tinned while the motherboard is tinned
• **High-quality steel material**: Imported selection of high-quality steel material, manufacture under QianLi black stencils standard, wear resistance, ultra high toughness to support reballing
• Square chamfer mesh: Prevent the tin balls from being stuck in the mesh

User's Guide:

• Put the lower layer of the motherboard that needs reballing to the corresponding positioning pins
• Place it in the synthetic stone base, install the SIM card baffle
• Align the stencils of the corresponding model with the positioning pins and put it into the base
• Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste
• Combine the top cover of the product with the base and operate, use the hot air gun to heat the corresponding reballing hole

Package includes:

• 1 x Reballing Platform
• 1 x Stencil