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Qianli 4-in-1 Magnetic Middle Layer BGA Reballing Platform for iPhone 16 Series

qianli 4-in-1-magnetic-middle-layer-bga-reballing-platform-for-iphone-16-16-plus-16-pro-16pro-max-1

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Product details

Description

Qianli 4-in-1 Magnetic Middle Layer BGA Reballing Platform for iPhone 16 / 16 Plus / 16 Pro / 16Pro Max


Features:

  • 4-in-1 Middle frame reballing platform, precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge, for iPhone 16/16 Plus/16 Pro/16 Pro Max

    **Accurate and Strong Magnetic Pressing**

  • To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space

    **Compact and Space-Saving Design**

  • Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take

    **Easy to Use with Sliding Dislocation Design**

  • CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing

    **High-Precision and Stable Positioning**

  • Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken

    **Strong and Accurate Magnetic Attraction**

  • High-temperature magnetic strong pressing prevents the stencils from bulging caused by high temperature

    **Prevents Bulging at High Temperature**

  • Avoiding SIM card base not being tinned while the motherboard is tinned

    **Avoids SIM Card Base Issues**

  • Imported selection of high-quality steel material, manufactured under QianLi black stencils standard, wear resistance, ultra high toughness to support reballing

    **Durable and Wear-Resistant Material**

  • Square chamfer mesh, prevents the tin balls from being stuck in the mesh

    **Convenient Square Chamfer Mesh**


User's Guide:

  • Put the lower layer of the motherboard that needs reballing to the corresponding positioning pins

  • Place it in the synthetic stone base, install the SIM card baffle

  • Align the stencils of the corresponding model with the positioning pins and put it into the base

  • Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste

  • Combine the top cover of the product with the base and operate, use the hot air gun to heat the corresponding reballing hole


Package Includes:

  • 1 x Reballing Platform

  • 2 x Stencil

qianli 4-in-1-magnetic-middle-layer-bga-reballing-platform-for-iphone-16-16-plus-16-pro-16pro-max-1
qianli 4-in-1-magnetic-middle-layer-bga-reballing-platform-for-iphone-16-16-plus-16-pro-16pro-max-2
qianli 4-in-1-magnetic-middle-layer-bga-reballing-platform-for-iphone-16-16-plus-16-pro-16pro-max-3
qianli 4-in-1-magnetic-middle-layer-bga-reballing-platform-for-iphone-16-16-plus-16-pro-16pro-max-4
qianli 4-in-1-magnetic-middle-layer-bga-reballing-platform-for-iphone-16-16-plus-16-pro-16pro-max-5
qianli 4-in-1-magnetic-middle-layer-bga-reballing-platform-for-iphone-16-16-plus-16-pro-16pro-max-6

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