Qianli 6-in-1 Magnetic Middle Layer BGA Reballing Platform for iPhone 15 Series (15 / 15 Plus / 15 Pro / 15 Pro Max)

Qianli 6-in-1 Magnetic Middle Layer BGA Reballing Platform for iPhone 15 / 15 Plus / 15 Pro / 15Pro Max

Features:

• Compact Design:** Precise positioning for the motherboard in high precision, strong magnetic pressing with no bulge, for iPhone 15/15 Plus/15Pro/15Pro Max
• To show the beauty of design in a compact shape, motherboard reballing without worry is compact and easy, saving space
• Magnet sliding dislocation design, smart application of the sliding dislocation design, easy to take
• CNC high-precision integrated processing, stable positioning for the motherboard, no deviation in reballing
• High-Temperature Resistance:** Strong magnetic attraction, accurate positioning no offset, and encountering high-temperature magnetism will not weaken
• High-temperature magnetic strong pressing prevents the stencils from bulging caused by high temperature
• Avoiding SIM card base not being tinned while the motherboard is tinned
• Imported selection of high-quality steel material, manufacture under QianLi black stencils standard, wear resistance, ultra high toughness to support reballing
• Square chamfer mesh, prevent the tin balls from being stuck in the mesh

User's Guide Shows:

• Put the lower layer of the motherboard that needs reballing to the corresponding positioning pins
• Place it in the synthetic stone base, install the SIM card baffle
• Align the stencils of the corresponding model with the positioning pins and put it into the base
• Apply the solder paste at the corresponding temperature to the reballing hole, make sure that each hole is covered with solder paste
• Combine the top cover of the product with the base and operate, use the hot air gun to heat the corresponding reballing hole

Package includes:

• 1 x Reballing Platform
• 2 x Stencil