Relife RL-044 BGA Reballing Stencil 0.12mm Middle Layer for iPhone 16 / 16+ / 16 Pro / 16 Pro Max
0 out of 5 stars
No review yet| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -2.7% |
| 5 | NaN | -4.9% |
| 10 | NaN | -8.5% |
Please select Type
Choose a Type
IPM18/for iPhone 16/16 Plus
IPM19/for iPhone 16 Pro/16Pro MaxProduct details
Description
Relife RL-044 0.12mm Middle Layer BGA Reballing Stencil for iPhone 16 / 16 Plus / 16 Pro / 16Pro Max
Package Details
- 1 x Stencil
Important Notice
**Before Use:** Remove the heat dissipation sticker on the bottom of the motherboard, then plant the tin. **After Use:** Remove the steel stencil before heating!!!
Key Features:
- **Stencil Thickness:** 0.12mm
- **Compatibility:** iPhone 16, 16 Plus, 16 Pro, 16 Pro Max
Customer reviews
0.0/ 5.0
0
0
0
0
0
