Relife RL-044 0.12mm Tin Planting Stencils for iPhone 7-13 Repair (CPU / Baseband / WiFi / NFC / BGA)
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Product details
Description
Relife RL-044 0.12mm Tin Planting Stencils for iPhone 7 to 13 CPU/Baseband/WiFi/NFC /BGA Repair
Features:
- Suitable for iPhone 7 to 13 CPU/baseband/WI-FI/NFC/BGA, etc.
- Ultra-thin design, better fit with tin planting, continuous bending, and full toughness
- Quick heat dissipation to avoid excessive temperature and damage to components
- Round and square precise hole position makes the tin ball more rounded and prevents the mesh from jamming the tin ball
- Summary:** High-quality BGA stencils for efficient iPhone repair
Specification:
- Brand: RELIFE
- Name: Precision BGA stencils
- MODEL: RL-044
- Net Weight: About 5g
- Gross Weight: About 30g
- Product Size: 80*100*0.12mm
- Thickness: 0.12mm
- Package Size: 145*100*10mm
- Material: High-quality special steel
Package includes:
- 1 x BGA stencil
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