Relife RL-044 Android CPU Reballing Stencil Set for Qualcomm / MTK / Hisilicon Tinned BGA

Relife RL-044 Android CPU Tinned BGA Reballing Stencil Set for Qualcomm / MTK / Hisilicon

Features:

• Precise alignment/Fast and convenient/High-temperature resistance/No deformation
• The real machine is measured to ensure accuracy, and each stencil is checked according to the original factory drawings to ensure that every solder joint cannot be missing
  Accurate Measurement
• It is specially designed and used for mobile phone chips. The round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips
  Special Design for Mobile Phone Chips
• Ultra-thin design, better fit of tin planting, continuous bending, and full toughness
  Ultra-Thin Design
• Suitable for Qualcomm Snapdragon 888/SM8350/845/SMD845/765G/SM7250/855/SM8150/865 Large/SM8250-002/865 Small/SM8250/8Gen1/SM8450/888/SM8350 Anti-Short Circuit Isolation/780/775/SM7350/ 778G/SM7325
  Wide Compatibility
• High-quality special steel is selected, which has good high-temperature resistance and metal fatigue resistance so that each tin point is heated evenly
  High-Quality Steel
• The round and square precise hole position makes the solder balls more rounded and prevents the mesh holes from jamming the solder balls
  Precise Hole Position

Suitable Models:

• Suitable for Qualcomm Snapdragon 888/SM8350/845/SMD845/765G/SM7250/855/SM8150/865 Large/SM8250-002/865 Small/SM8250/8Gen1/SM8450/888/SM8350 Anti-Short Circuit Isolation/780/775/SM7350/ 778G/SM7325
• Compatible with Dimensity 810/MT6833V/720/MT6853V/800/MT6873V/900/MT6877V/1000/MT6885Z/9000/MT6983Z
• Suitable for Hisilicon 710 HI6260/810 HI6280/960 HI3660/970 HI3670/980 HI3680/985/820 HI6290/L/990 HI3690 5G/Kirin 990/4G HI3690/9000 HI36A0
• For BGA 134/153/162/178/211/254
• Applicable to/Hisilicon Qualcomm RAM upper layer/Kirin 9000 upper layer/Kirin 970/980/990 upper layer/Snapdragon 865+/870/888 upper layer

Package includes:

• 35 x Stencil