Relife RL-044 Android Series BGA Reballing Stencil Set for Qualcomm, MTK, Hisilicon, Exynos & EMMC BGA
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Product details
Description
Relife RL-044 Android Series BGA Reballing Stencil Set for Qualcomm / MTK / Hisilicon / Exynos / EMMC BGA
Product Overview
This RL-044 Android series chip planting tin steel stencil set is designed for precise alignment, fast and convenient use, and high-quality steel construction. It features round square holes, high-temperature resistance, and no deformation.
Key Features
- Supports Multiple Chipsets: Qualcomm Snapdragon, Dimensity, Hisilicon Kirin, Exynos, BGA, Android, and other series.
- Accurate Design: Designed based on actual mobile phone measurements to ensure accuracy, with each mesh calibrated according to mobile phone drawings to ensure every solder joint is indispensable.
- Precise Hole Positioning: Round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips.
- Ultra-Thin and Super Tough: Ultra-thin design for better fit of tin planting, continuous bending, and full toughness.
- High-Temperature and Wear Resistance: High-quality special steel selected for good high-temperature resistance and metal fatigue resistance, ensuring each tin point is heated evenly.
- Efficient Soldering: Summary: Prevents mesh holes from jamming solder balls. The round and square precise hole position makes the solder balls more rounded and prevents the mesh holes from jamming the solder balls.
What's Included
- 58 x Stencil
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