Relife RL-088 Universal Magnetic Base for BGA Soldering Repair of Mobile Phone

Relife RL-088 Tin-planted Universal Magnetic Base for Mobile Phone BGA Soldering Repair

Features:

• Universal Magnetic Fixture**: Say goodbye to paper towel planting tin, which can be used for chip positioning and adhesive removal, and strong magnetic adsorption for tin planting.
• **Anti-Static and High-Temperature Resistant**: It has the characteristics of anti-static, strong magnetic adsorption, high-temperature resistance, steel plate weight gain, chemical corrosion resistance, etc.
• Multi-Functional and Double-Sided**: Suitable for repairing motherboards of different shapes, general tin planting of various BGA chips, etc. Front side - suitable for all kinds of BGA chips; Reverse side - suitable for different shapes of motherboards.
• **Effective Tin-Planting**: Various types of tin-planting stencils are commonly used, which can effectively avoid the phenomenon of tinning on the bottom of the stencil due to heating and swelling.
• Auto-Balancing and Decompression Protection**: Multifunctional position adjustment, decompression protection, tin planting automatically balances the stencil and decompresses it, effectively protecting the chip and making it safer.
• New Silicone Material**: High-temperature resistance without bulging, flame retardant, corrosion resistance.
• Insulating Material**: With good anti-collision / anti-skid / anti-acid properties, and wear-resistant and easy to clean.
• Embedded High-Temperature Magnets**: Strong magnetic adsorption, precise positioning, no offset, high-temperature magnetism unchanged.
• High-Quality Steel Material**: High hardness weight-added steel, strong anti-deformation ability, high-quality carbon steel material, not afraid of corrosion.

Package Includes:

• 1 x Magnetic Base