Relife RL-223-OR Solder Paste for SMD, BGA, PCB Reballing and Welding Applications
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Product details
Description
Relife RL-223-OR Solder Paste for PCB SMD BGA Reballing Welding
Product Overview:
This high-quality solder paste is designed for phone mainboard BGA SMD PCB reballing repair. It offers fast tinning with minimal smoke and residue, making it an ideal choice for mobile phone PCB, BGA, and PGA rework.
Key Features:
- Fast Tinning**: Running tin is fast, less smoke
- No-Clean Formula**: Easy to tin, no residue
- Versatile Application**: Applicable to mobile phone PCB, BGA, and PGA rework
- Net Weight**: 100g
- **Summary:** High-quality solder paste for phone mainboard BGA SMD PCB reballing repair with fast tinning and no residue
Package Includes:
- 1 x Relife RL-223-OR Solder Paste
Important Note:
Due to FedEx DHL restrictions, this product can only be shipped by Singapore Post - Standard Mail or Registered Mail. If your order includes other products, we will separate this item and ship it via Singapore Post - Standard Mail or Registered Mail, while the other products will be shipped via the courier of your choice. Thank you for your understanding.
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