Relife RL-404 40g Low-Temperature 138°C Lead-free Tin Paste for Mobile Phone BGA Repair
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Product details
Description
Relife RL-404 40g 138°C Low-Temperature Melting Point Lead-free Tin Paste for Mobile Phone BGA Repair
Product Description:
The RL-404 is a low-temperature lead-free solder paste specifically designed for high-end motherboard repair. It offers a unique combination of benefits, making it an ideal choice for professionals and DIY enthusiasts.
Features:
- Low Melting Point:** 138°C for easy and safe repair
- Tin Lighting/Climbing Tin Strong/High Purity/Temperature Standard/Easy to Store
- High Performance:** High Density/High Resistance Strong Activity/Strong Welding Force
- Pure Alloy Composition/Fine Viscosity /Tin Plating Does Not Bubble Silver Highlights Good/Environmental Protection Without Any Chemical Pollution
- Compatibility:** Meet the maintenance needs of motherboards for Huawei and Apple high-end machines
Package includes:
- 1 x Tin Paste (40g)
Noted:
Due to FedEx DHL cannot send out the parcel that comes with Liquid, so we just can send out it by Singapore Post - Standard Mail or Registered Mail. If your order has other products, we will take out this to send by Singapore Post - Standard Mail or Registered Mail, and other products will send out by the courier which you choose. Thanks for understanding.
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