Relife RL-601MA Universal BGA Reballing Tin Base for iPhone, HiSilicon, Qualcomm & MTK Devices
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Seller: Worldswa Shenzhen
ID: MV-230629M3749E
Weight: 0.20 kg
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| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
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Base + iPhone Stencil Set/9Pcs
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Base + iPhone & Android Stencil Set/44PcsProduct details
Description
Relife RL-601MA Universal BGA Reballing Planting Tin Base for iPhone / HiSilicon / Qualcomm / MTK
Features:
- Universal Compatibility: Supports multiple CPU maintenance positioning for all kinds of BGA mobile phone chips.
- Strong Magnetic Adsorption: Precise positioning, high-quality synthetic stone, high-temperature resistance, and anti-static.
- New Magnetic Power Positioning: Strong magnetic automatic clamping, convenient and flexible, supporting multiple CPU maintenance positioning, stable and reliable clamping.
- High-Temperature Magnets: Embedded magnets with strong magnetic adsorption, precise positioning, no offset, and high-temperature magnetism unchanged.
- Multi-Chip Support: Universally supports more chip CPU/hard disk/font library and other IC clamping.
- Unlimited Expansion: **Universal for all kinds of BGA chips**, supporting IP series, HiSilicon series, Qualcomm series, and other CPU repair positioning.
- Magnetic Adsorption Steel Mesh: Free hands, scrape tin without moving, more uniform.
- High-Quality Stone: High strength, anti-dirt, easy to clean, wear-resistant, non-slip, shock-absorbing, and compression-resistant, anti-aging.
Package Includes:
- 1 x Base
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