Kslid P100 Pre-Cut Thermal Pads 12x12x1.5mm, 100Pcs for Mobile Phone Motherboard Chip

Kslid P100 12x12x1.5mm Pre-Cut Thermal Pads for Mobile Phone Motherboard Chip - 100Pcs

Product Description:

These thermal pads are designed for mobile phone motherboards, providing excellent heat dissipation and insulation. With a thermal conductivity of up to 6.0W/MK, they quickly fill tiny gaps and rapidly conduct and dissipate heat generated by high-power CPUs/GPUs.

Features:

• High Thermal Conductivity:** Up to 6.0W/MK for efficient heat dissipation
• High pressure and high temperature resistant, safe and stable
• Strong heat conduction and heat dissipation
• Strong insulation and comprehensive protection
• Escort for electronic equipment, excellent heat dissipation, worry-free insulation, suitable for Apple, Android phones, high-power LED modules, Integrated chips, and other scenarios (Summary: Excellent heat dissipation and insulation for various electronic devices)

Usage Method:

• First, clean the surface of the adhesive or back paste, and remove dust and oil
• Remove the protective film on one side first (do not remove both protective films at the same time) to avoid damaging product viscosity and thermal conductivity
• Put the side of the removed protective film on the radiator, and install it to dissipate heat. Apply a certain pressure to ensure that the heat conductive sheet is fixed, and then tear off the other side of the cuticle

Package Includes:

• 100 x Thermal Silicone Pads