SUGON 2020D 700W Lead-Free Hot Air Gun Rework Soldering Station for BGA SMD

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Product details
Description
SUGON 2020D 700W Hot Air Gun Lead-Free Rework BGA SMD Soldering Station
Features:
- **Microcomputer Temperature Control**: Sensors, closed-circuit, the zero passage trigger temperature control of the microcomputer, LED display, big power, heating is rapid, accurate and stable temperature, not affected by the air volume, truly lead-free desoldering.
- **Adjustable Airflow**: Adjustable airflow, air volume big and soft wind, temperature control is convenient, can be suitable for a variety of purposes.
- **Induction Switch**: The handle is equipped with an induction switch, as long as the handshake hands handle, the system can quickly enter the working mode; the Handle is released into the handle frame, the system will enter the standby mode, easy to operate in real-time.
- **Automatic Air Cooling**: The system is equipped with an automatic air cooling function, which can prolong the life of the heating element and protect the heat gun.
- **Brushless Fan**: Adopts brushless fan very long life, small noise, using high-quality heating element under the same power efficiency can be doubled, and can effectively prolong the working life of the heating element and power saving.
- **Safety Protection**: The machine is equipped with a safety protection function.
- **Temperature Conversion**: Celsius and Fahrenheit temperature conversion.
- **Calibration Temperature**: Calibration temperature function. If the heating element is replaced, the temperature must be recalibrated. This machine uses the digital temperature calibration method to correct the incremental key input, easy and quick to adjust.
Specifications:
- Power consumption: 700 w
- Airflow type: brushless fan soft wind
- Gas flow rate: 100 liters/minute.
- Temperature control range: 100 ° C - 500 ° C / 212℉-932℉
- Display form: LED digital (resolution 1 ° C)
- Handle component length: 120 cm
- Noise: less than 45 db
Applicable Use:
Desoldering is suitable for a variety of components, such as SOIC, CHIP, QFP, PLCC, BGA (especially suitable for a mobile phone line and row line of desoldering); Used for heat-shrinkable, drying, in addition to the paint, in addition to the glue, thawing, preheating, welding, etc.
Package includes:
- 1 x SUGON 2020D
- 1 x Power Cable
- 1 x Handle
- 2 x Cyclone nozzle (7mm,9mm)
- 3 x Straight nozzle (4mm,7mm,9mm)





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