Sunshine SS-T12B Universal Intelligent Motherboard Heating Platform for Android & iPhone 7 to 16PM

Sunshine SS-T12B Universal Intelligent Motherboard Heating Platform for Android & iPhone 7 to 16PM

Features:

• SS-T12B Multi-functional universal intelligent maintenance heating Platform, support Android+iPhone series / Upgradable and expandable design / Safe and fast layered fit / No air gun soldering iron

• Supports bonding and separation of Android and iPhone 7G to 14Pro Max motherboards, separation of screen frames, etc., and will continue to be updated in the future

• Precise temperature control / Smart digital display / Rapid heating / Unlimited expansion

• Modular design, a variety of combined modules, common modules on the base, good scalability, easy-to-expand new modules

• The heating area is large, the compatibility is good, and it supports the desoldering operation of various motherboard components, which is more convenient and quick

• Intelligent temperature control, customized temperature adjustment according to different melting points, with fast heating, long life, and uniform temperature

• Supports bonding and separation of Android and iPhone X to 16Pro Max motherboards, separation of the screen frame, etc., fast and accurate layering, tin planting, glue removal, and bonding of motherboards, etc

• 360° rotating buckle + guide rail design, suitable for precise clamping of motherboards of different shapes, improving maintenance efficiency

• Module quick-release buckle, easy to take out and put in. (Note: before replacing the module after heating, be careful of residual heat burns)

• Precise positioning, the module is equipped with a positioning column, which can be accurately separated and attached to the main board, and is easy to take

• Heat dissipation and anti-slip design, hollow heat dissipation design, high-temperature resistance; Silicone wear-resistant foot pads, stable operation, good anti-skid effect

The Modules used for:

• T12B-IP1: Common for most models of screen bracket separation/fingerprint repair/CPU chip degumming/face repair

• T12B-IP2: Fingerprint repair/A12/A11/X/XS/XSM motherboard delamination

• T12B-IP3: iPhone 11/11P/11PM/A13 motherboard layering

• T12B-IP4: CPU chip degumming/12/12Mini/12P/12PM motherboard layering

• T12B-IP5: iPhone 13/13Mini/13P/13PM/A15 motherboard layering

• T12B-IP6: iPhone 14/14Plus/14P/14PM/A15/A16 motherboard layering

• T12B-IP7: iPhone X/XR/XS/XSM/12P/12PM/13/13Mini camera

• T12B-IP8: iPhone 11/11P/11PM/13P/13PM camera

• T12B-IP9: iPhone 7G/7P/8G/8P/11/12/12Min/14/14Plus/14P/14PM camera

• T12B-IP10: Android universal

• T12B-lP11: iPhone 15/15Plus/15P/15PM/A16/A17 motherboard layering
• T12B-lP12: iPhone 16/16Plus/16P/16PM/A18/A18Pro motherboard layering

Package includes:

• According to your choice