TuoLi TL-19A 10in1 BGA Motherboard Reballing Stencil Platform for iPhone X to 12 Pro Max
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Product details
Description
TuoLi TL-19A 10in1 BGA Mid-level Motherboard Reballing Stencil Platform for iPhone X - 12 Pro Max
Product Overview
This TuoLi TL-19A Reballing Stencil Platform is a professional tool designed for mid-level motherboard repair. It supports iPhone X to iPhone 12 Pro Max and features a 10-in-1 design for efficient tin planting and reballing.
Key Features:
- Tin-planting Platform for precise tin planting and reballing
- Mid-level Motherboard Support for iPhone X to iPhone 12 Pro Max
- Magnetic Adsorption for precise positioning and easy tin scraping
- Double-Sided Positioning for 10-in-1 convenience
- Magnetic Fitting Design for secure stencil and motherboard fit
- Cylinder Alignment for high-precision matching and perfect CPU solder joint alignment
- Summary:** **Effortless Tin Planting and Reballing** with precise alignment and magnetic adsorption
What's in the Box:
1 x TuoLi TL-19A Reballing Stencil Platform
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