Universal CPU BGA Tin Planting and Glue Removal Platform for Qualcomm, HiSilicon, MediaTek and iPhone Devices
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Product details
Description
Universal CPU BGA Tin Planting and Glue Removal Platform for Qualcomm/HiSilicon/MediaTek/iPhone
Features:
- Universal Compatibility: Universal tin-planting and glue removal platform, including 43 tin-planting stencils, 6 font nets, 18 Qualcomm CPU nets, 8 HiSilicon CPU nets, 9 MediaTek CPU nets, 9 Apple nets for A8 to A16, unlimited upgrades (Supports various CPU types)
- Precise Positioning: Precise positioning slotting, magnetic suction design for stable operation
- High-Temperature Resistance: High-temperature resistance, planted tin fine who (Ensures durability and longevity)
Package Includes:
- 1 x Base
- 52 x Stencil
Customer reviews
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