WL 0.12MM Multi-Function BGA CPU Reballing Stencil - Tin Steel Net for MTK / Qualcomm / HiSilicon Plant
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HU C1HU C2MTK C1MTK C2QU C1QU C2QU C3QU C4
Product details
Description
WL 0.12MM Multi-Function BGA CPU Reballing Stencil Plant Tin Steel Net for MTK Qualcomm HiSilicon
Compatibility:
- MTK C1: MT6272A / MT6582 / MT6589 / MT6580A / MT6755 / MT6595
- MTK C2: MT6750 / MT6797W Upper / MT6797W Lower / MT6735 / MT6732 / MT6795W
- HU C1: HI3660 Upper / HI3660 Lower / HI3630 Upper / HI3630 Lower / HI3650 Upper / HI 3650 Lower
- HU C2: HI6520 / HI3630 Upper / HI3630 Lower / HI6620 / HI6220
- QU C1: MSM8992 Upper / MSM8992 Lower / MSM8996 Upper / MSM8996 Lower / MSM8976 Upper / MSM8976 Lower
- QU C2: MSM8928 Upper / MSM8928 Lower / MSM8994 Upper / MSM8994 Lower / MSM8960 Upper / MSM8960 Lower
- QU C3: MSM8974 Upper / MSM8974 Lower / MSM8998 Upper / MSM8998 Lower / MSM8937 / MSM8940
- QU C4: SDM660 / MSM8952 / MSM8953 1AB / MSM8953 B01 / MSM8916 / MSM7225A / MSN8612 / MSM8909
Package Includes:
1 X Reballing Stencil
Features Summary:
- Multi-function BGA CPU reballing stencil
- Tin steel net material for durability
- Compatible with various MTK, Qualcomm, and HiSilicon models
- Easy to use and install
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