WL 0.12MM PCB Positioning Mold Steel Plate BGA Reballing Stencil for iPhone X
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Product details
Description
WL 0.12MM PCB Positioning Mold Steel Plate BGA Reballing Stencil for repair iPhone X motherboard, iPhone X Positioning Mold steel plate, iPhone X Fixed Frame steel plate for BGA Reballing Stencil, iPhone PCB board Positioning Mold steel plate.Good toughness, Precise positioning, High precision hole position, Plant tin non-stick net and Easy to clean
Package include:
1 x Stencil net
Customer reviews
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