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WL High-Quality 4 in 1 NAND / PCIE Baseband CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballing Stencil with Fixed Plate for iPhone 6S / 6S Plus

WL High-Quality 4 in 1 NAND / PCIE Baseband CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballin

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Product details

Description

Description

WL High-Quality 4 in 1 NAND/PCIE, Baseband, A9 CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballing Stencil for iPhone 6S 6S Plus
With Fixed Plate, Easy to use and more accurate IC welding position

Package include:
1 x Steel Net
1 x Fixed Plate

WL High-Quality 4 in 1 NAND / PCIE Baseband CPU Upper and CPU Lower Tin Plate Steel Net BGA Reballin

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