WL Mini Magical Degumming Station: Phone IC Chips Heating and Degumming
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Product details
Description
WL Mini Magical Degumming Station for Phone IC Chips Heating & Degumming
Product Overview
This mini degumming station is designed for phone IC chips heating and degumming, providing a safe and convenient way to remove tin residue and glue.
Features:
- Adjustable Temperature**: 160℃~250℃ via USB power supply
- Gentle on Components**: No air gun heating, no soldering iron heating, no soldering tape, ensuring the pad and plate paint are not damaged
- Concealed Screw Design**: Flexible and lightweight, with a telescopic clamping mechanism that prevents residues from falling into the screw, making it more durable and easier to use
- Effortless Tin Removal**: Once heated to a set temperature, use a brush or cotton ball to easily remove residual tin, no suction wire needed
- Safe and Convenient**: After heating to a set temperature, use a cotton swab to dispose of tin residue without damaging the pad paint or absorbing the tin belt
- Low-Temperature Heating**: 100 degrees lower than air gun temperature, making it safer and more gentle on components
- Compact Working Area**: 20mm x 18.5mm, suitable for multiple generations of Apple mobile phone chips, Huawei mobile phone chips, general hard disks CPU glue, and tin removal
Package Includes:
- 1 x Degumming Station
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