WL Multi-Function BGA Reballing Stencil Plant Tin Steel Net for Samsung S8 / S7 / S6 / S5 / NOTE8 / NOTE5 / A7 / A5 / A3 / J7 / J5 / J3
0 out of 5 stars
No review yet| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -3.0% |
| 5 | NaN | -5.1% |
| 10 | NaN | -8.7% |
Please select Model
Choose a Model
SAM:1SAM:2SAM:3SAM:4SAM:5SAM:6
Product details
Description
WL Multi-Function BGA Reballing Stencil Plant Tin Steel Net
This stencil is compatible with a wide range of Samsung devices, including:
Supported Devices:
- S8 Series: S8, S8+, NOTE 8, G9500, G955U, N9550
- S7 Series: S7, G9300, 9350, 9308
- S6 Series: S6, S6+, NOTE 5, G9200, 9250, N9200
- A Series: A520, A310, S5 mini, A7, A5, A3, S5, J7
- A9/C9 Series: A9, C9, A9000, A9100, C9000
- J/C Series: C7010, J610, C7, J3, J5, A5
Features:
- Summary:** Multi-function BGA reballing stencil for repairing various ICs, including CPU, Font, Audio, Power IC, USB Control IC, HDD Nand, Baseband, EEPROM, and more.
Package Includes:
- 1 X BGA Reballing Stencil
Customer reviews
0.0/ 5.0
0
0
0
0
0
