Wylie WL-736L Universal Phone Motherboard Mid Frame Magnetic Platform for BGA Reballing
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Product details
Description
Wylie WL-736L Universal Phone Motherboard Mid Frame BGA Reballing Magnetic Platform
Features:
- High-Temperature Protection: High-temperature maintenance tinning protection silicone pads can be used for CPU/small board tinning, auto leveling stencil.
- Auto Leveling and Depressurization: Automatic leveling and depressurization when heated, preventing the stencil from bulging due to high temperature, leading to the phenomenon of stringing tin underneath, effectively protecting the absorber piece safer.
- Strong Magnetic Design: The strong magnetic design makes the steel mesh not easy to fall and shift, and the planting tin is more stable.
- Heat Dissipation Hole Design: The design of the heat dissipation hole makes the steel mesh plant tin without bulging.
- Durable Silicone Material: Silicone material, high-temperature resistance, easy to clean. **Summary: High-temperature resistant, flame retardant, and corrosion resistant.**
- Soft and Strong Silicone: Soft silicone material, high strength, and toughness, not easy to deform.
- Insulation and Easy to Clean: Insulation material, easy to clean, waterproof, and oil-proof, with good anti-collision/anti-slip/anti-acid characteristics.
Package Includes:
- 1 x Pad
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