XinZhiZao Universal High-Temperature Silicone Pad - IC Chip Soldering

XinZhiZao Universal High-Temperature Silicone Pad for IC Chip Soldering

Features:

• High-Temperature Resistance**: High-temperature silicone pads for magnetic soldering platform, soft enough, high toughness, slope design, high compatibility, good permeability
  Summary: Durable and resistant to high temperatures
• Convenient Tinning**: Matching C4 base for more convenient tinning, full adhesion to C4 base, strong magnetism for chip adhesion, no movement, convenient for tinning
  Summary: Easy and convenient tinning process
• Flexible and Durable**: Soft material, twist at will, folding, stretching can be, easy to store, toughness, durability
  Summary: Flexible and long-lasting material
• Thermal Insulation**: Layered thermal insulation, multi-layer heat dissipation, high-temperature resistance, strong thermal insulation, safe for soldering
  Summary: Effective thermal insulation for safe soldering
• Strong Flux Magnetism**: With strong flux magnetism, the heat insulation pad has no loss of magnetism, which can make the base firmly absorb the chip stencil, convenient for tin planting
  Summary: Strong magnetism for secure chip placement
• Innovative Slope Design**: Innovative slope design for better chip fit, compatible with thinner IC chips, no overhanging pads, and more uniform
  Summary: Optimized design for easy chip placement
• Wide Compatibility**: Good compatibility, suitable for chip thickness below 0.9mm, most of the current cell phone chips assisted tinning
  Summary: Compatible with a wide range of IC chips

Package Includes:

• 1 x Silicone Pad