XZZ Android CPU Staging BGA Reballing Stencil for SDM845 SM8350 MSM8996 MSM8998 HI36A0 HI3670 / 80 / 90
0 out of 5 stars
No review yet| Qty | Price | Discount |
|---|---|---|
| 1 | NaN | |
| 3 | NaN | -3.0% |
| 5 | NaN | -5.1% |
| 10 | NaN | -8.7% |
Product details
Description
XZZ Android CPU Staging BGA Reballing Stencil for SDM845 SM8350 MSM8996 MSM8998 HI36A0 HI3670 / 80 / 90
Package includes:
- 1 x Stencil
Customer reviews
0.0/ 5.0
0
0
0
0
0
