XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone, Qualcomm, MTK & Hisilicon Processors
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Seller: Worldswa Shenzhen
ID: MV-230510F492S8
Weight: 0.02 kg
| Qty | Price | Discount |
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| 1 | NaN | |
| 3 | NaN | -2.9% |
| 5 | NaN | -5.0% |
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only Stencil for iPhone
only Stencil for Qualcomm
only Stencil for MTK
only Stencil for Hisilicon
only Composite StencilProduct details
Description
XZZ L23 CPU Universal BGA Reballing Stencil Platform for iPhone / Qualcomm / MTK / Hisilicon
Features:
- Adopt new magnetic power positioning, strong magnetic force clamping firm, automatic alignment
Easy and convenient to operate - Built-in powerful magnets, strong adsorption, no snaps, easy to pick up, fast maintenance work
Effortless maintenance and repair - Easy to operate stable clamping, put in the chip, automatic clamping, flexible pull full
Stable and secure clamping - The base is made of synthetic stone, green and environmentally friendly, with high-temperature resistance, high strength, dirt resistance, easy to clean characteristics
Eco-friendly and durable base material - Tin-planting table using environmentally friendly rubber feet, with wear-resistant anti-skid, shock absorption, anti-pressure, anti-aging, non-toxic, tasteless, and high-temperature resistance, etc
Advanced rubber feet for added stability
Supported Models:
- Qualcomm: 765G, 778G, 845, 855, 865/870, 888/888 Plus, 8 Gen1, 8+ Gen1, 8 Gen2
- MTK: 720, 800, 810, 900, 1000, 1100, 9000, 9200
- Hisilicon: 710, 960, 970, 810, 980, 820/985, 990, 9000
- iPhone: A8, A9, A10, A11, A12, A13, A14, A15, A16
What's Included:
- 1 x Tin Planting Platform
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