YCS-H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Repair Soldering
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Product details
Description
YCS-H03 MAX Universal Motherboard Chip Ring Fixture for Mobile Phone Soldering Repair
Product Overview
This universal motherboard chip ring fixture is designed for mobile phone soldering repair, offering a larger size with more clamping space to accommodate various types of chips and motherboards.
Key Features:
- Larger Clamping Space: Fully applicable to various types of chips/motherboards (Accommodates multiple sizes)
- Easy Tin and Glue Removal: No need to adjust the direction, travel coaxial movement (Saves time and effort)
- Universal Compatibility: Suitable for iPhone / Android full series IC chip, removal of glue/tin without blocking the knife (Works with all major phone models)
- Effortless Motherboard Cleaning: Cleaning doesn't require adjusting the orientation, clean up at once (Streamlines the repair process)
- Versatile Module: Suitable for various sizes of motherboards in all aspects (Adaptable to different repair needs)
What's Included:
- 1 x YCS-H03 MAX Universal Motherboard Chip Ring Fixture
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